Case study
Learn how the manufacturer of an AC/DC power supply leveraged a robust thermal management solution for its compact design.
Already have an account?
The customer's new AC/DC power supply for cloud and hyperscale data centres required a robust thermal management solution for its compact design.
Different substrate surface topographies across the device dictated an adaptable material that could accommodate dimensional variations to maximise thermal transfer.
It also had to secure parts, dissipate heat and reduce mechanical stress while working within the space constraints of the new design.
Our experts are here to learn more about your needs.
Our support center and experts are ready to help you find solutions for your business needs.