Henkel's PDS aerial technology enables design flexibility for smaller spaces and effectively replaces incumbent aerial techniques.
Miniaturisation and design flexibility continue to be primary drivers for mobile device innovation. In order to achieve these objectives, it is necessary to reduce the size, and accommodate different shapes and locations of aerial structures while still maintaining the performance required for high bandwidth 5G applications.
Henkel's PDS aerial technology frees mobile device manufacturers from conventional, non-sustainable techniques, allowing extreme design latitude and robust aerial performance.
Flexible Printed Circuit
(FPC) Aerial
Laser Direct Structuring
(LDS) Aerial
Printing Direct Structuring
(PDS) Aerial
Adaptability to substrates
Adaptability to curves
Environment friendliness
Cost
Reliability & consistency
Thinness
Made possible through high-conductivity LOCTITE® printable inks, Henkel's solution provides market-leading capability for remarkably thin, yet powerful 5G connectivity.
- Excellent design flexibility
- Space-efficient with 3D shaping for smaller size
- Boost aerial performance (RF performance)
- Sustainable manufacturing and shorter production cycle
Our technical experts analyse your requirements and processes, and recommend ways to make them more efficient, cost-effective and sustainable. With Henkel's PDS material technology, the future of connectivity is thin and powerful.
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